• 富藤科技產品信息

    產品名稱:Ultrasonic Ribbon Bonder

    產品類別:Ultrasonic Bonding Machine

    Ultrasonic Ribbon Bonder

    Ultrasonic Ribbon Bonder


    超聲波帶狀鍵合機

    Appropriate for forming next generation power device circuit

    適合形成下一代功率器件電路

    • Flexible manufacturing by exchanging heads
    • 通過交換頭實現柔性制造
    • Equip muti-feeder to deal with heterogeneous materials
    • 配備多喂料器可以適應異質物料
    • It can bond to a feeble material
    • 可以實現與微弱材料的鍵合
    • Equip color image processor
    • 配備彩色圖像處理器

    Homogeneous/Heterogeneous Metal Bonding

    Homogeneous/Heterogeneous Metal Bonding

    同類/異類金屬鍵合

    It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature

    它可在室溫下直接鍵合異類金屬,這是傳統焊接方法難以實現的。

    IGBT Module (Ribbon Bonding)

    IGBT Module (Ribbon Bonding)

    IGBT 模塊 (Ribbon Bonding)

    Multiple kinds of ribbon bondings are available with multi-feeder

    多喂料器可實現多種帶狀鍵合

    ABB Process

    ABB Process

    Cu ribbon bonding is available by using Al as a buffer material, it gives strength to a feeble base material

    使用鋁作為緩沖材料可以實現銅帶狀鍵合, 可以提高薄弱基礎材料的強度

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